Samsung Galaxy Z Flip 8 is shaping up to be one of the company's most closely watched foldable launches this year. Industry leaks suggest the next clamshell will pair a major chipset shake-up with a refined, almost crease-free display and a July reveal at Samsung's Galaxy Unpacked event, likely in London.

The Samsung Galaxy Z Flip 8 is tipped to ship with two processor options: Samsung's in-house Exynos 2600 and Qualcomm's Snapdragon 8 Elite Gen 5 for Galaxy, depending on region. Reports indicate that Qualcomm has offered Samsung more favourable pricing for its flagship Snapdragon part, prompting a split-chip approach similar to the Galaxy S26 series.

According to tipster Lanzuk, markets such as the US, Canada, China and Japan are expected to see Snapdragon-powered units, while India, Europe and South Korea are more likely to receive the Exynos 2600 variant. Both options are flagship-class, with the 2nm Exynos 2600 promising up to 113 percent better generative AI performance and as much as 39 percent higher overall performance compared with the Exynos 2500 used in last year's Galaxy Z Flip 7.

Beyond the silicon, the Samsung Galaxy Z Flip 8 is rumoured to address one of the biggest complaints about earlier Flip models: the crease. Multiple leaks point to a "crease-free" or barely visible fold line, delivered through a revised hinge and a slightly wider, thinner chassis that still folds into a compact square.

The phone is expected to be around 0.5mm thinner when folded and lighter at about 180g, down from 188g on the Galaxy Z Flip 7, while retaining a 4,300mAh battery with 25W wired charging. Core hardware, including a 50-megapixel main camera, 12-megapixel ultra-wide lens and 10-megapixel selfie camera, is likely to remain broadly similar to the outgoing model, alongside a 6.9-inch 120Hz main display and larger outer Flex Window.